长春海洋光电有限公司-长春海洋光电有限公司

工业应用的热电致冷器的主要应用:
* 工业电子学和通讯方面的应用
* 具有不同功能的热电冷却组件及调节器
* 碗橱和电子设备用的热电致冷器件
* 不同类型机器的关键部件和组件的温度控制系统
* 热流探测
* 半导体集成为芯片产品
* 激光设备
* 医学设备
* 传送器
* 食品工业
* 特殊设备

To notate thermoelectric coolers with a hole a system of notation of standard single-stage thermoelectric coolers with an index is used:

CH — for rectangular modules with a central hole (for example ТВ-43-1.0-0.8CH)

CHR — for round coolers with a central hole

(for example ТВ-19-1.0-1.3CHR)

R — for round coolers (for example TB-253-1.4-1.5R)

Name

Imax
(A)

Qmax
(W)

Umax
(V)

dTmax
(K)

R
(Ohm)

A
(mm)

B
(mm)

H
(mm)

D
(mm)

TB-41-1.0-1.5CH

3.1

9.6

5.1

1.20

20.0

3.8

6.5

TB-41-1.0-0.8CH

5.7

18.6

5.3

0.70

22.5

17.5

3.1

9.5

TB-41-1.0-1.3CH

3.6

11.7

5.3

1.10

22.5

17.5

3.6

9.5

TB-119-1.0-1.3CH

3.6

32.3

14.7

3.10

30.0

3.6

4.0

TB-119-1.0-1.5CH

3.1

28.0

14.7

3.40

30.0

3.8

4.0

TB-119-1.0-2.0CH

2.3

21.0

14.7

4.90

30.0

4.3

4.0

TB-41-1.4-1.1CH

8.2

25.1

5.0

0.45

23.0

3.6

9.5

TB-109-1.4-1.5CH

6.1

51.0

13.7

1.80

40.0

4.0

13.0

TB-119-1.4-1.15CH

7.9

72.0

14.7

1.40

40.0

3.4

7.8

TB-119-1.4-1.5CH

6.1

56.0

14.9

1.90

40.0

3.9

7.8

TB-119-1.4-2.5CH

3.7

35.1

15.3

3.00

40.0

4.8

7.8

TB-125-1.4-1.15CH

7.9

75.0

15.5

1.50

40.0

3.4

4.7

TB-125-1.4-1.5CH

6.1

59.0

15.7

2.00

40.0

3.9

4.7

TB-125-1.4-2.5CH

3.7

36.8

16.0

3.10

40.0

4.8

4.7

STANDARD TERMS OF DELIVERY:

— substrate material — alumina (ВК-96)

— height tolerance ± 0,05 mm (L1)

— parallelism 0,03 mm (L1)

— wire length 120 mm

— pin orientation (for rectangular coolers) — to the longer side

— processing temperature up to 80°С, maximal assembly temperature 120°С (assembly solder Tm = 139°С)

ADDITIONAL OPTIONS

*Description*	**Notation ()***	*Note*
processing temperature up to 120 °C, max assembly temperature = 130 °C	HT(120)	assembly solder with Tm = 139 °C
processing temperature up to 150 °C, max assembly temperature = 170 °C	HT(150)	assembly solder Pb-Sn with Tm = 183 °C
processing temperature up to 200 °C, max assembly temperature = 220 °C	HT(200)	assembly solder with Tm = 232 °C
special version for operation under conditions of temperature cycling	С	> 10⁵ cycles +40C/+90 °C
height tolerance = ± 0.025 mm and parallelism 0.02 mm	L2
height tolerance = ± 0.015 mm and parallelism 0.01 mm	L3
metallization of cold (mc) and (or) hot side of cooler with solder tinning (melting temperature = 95 °C, 117 °C, 139 °C, 183 °C)	mc95, mh95, mm117 etc.
gold plating	mcAu, mhAu, mmAu	metallization Cu-Ni-Au (0.2-1 micron)
substrate material – aluminium nitride (AlN)	N	heat conductivity > 180 W/mK
sealant: epoxy, silicon, urethane, conformal coating	E, S, U, Сс
non-standard pin orientation
type and length of wires by customer’s requirement
сonnection to arraies
сonnectors crimping
soldering on cold or hot heatsink, packaging or cold block

Qmax：热电致冷器的最大冷却能力。当热电致冷器的热面和冷面之间保持温差为零，逐渐升高热电致冷器的电流到最大电流Imax。此时，热电致冷器达到最大冷却能力。

例如：TB-161-1.4-1.5模块: 161是热电偶对数，(322是热电偶的元素)