微热电制冷器
微型热电致冷器的主要应用:
* 微波技术--高灵敏度接收器和放大器的输入级冷却
* 参量法大器的热稳定
* 光电子学--半导体激光器,红外探测器,CCD矩阵的接触冷却
* 光电倍增管制冷调节器
* 特殊计算机工程--微处理器的热电致冷冷却器
技术特征: 我们也提供把微型热电致冷器安装或直接集成进标准的TO
(TO3, TO8等),HHL, DIL,butterfly或特殊装置内.
A universal abbreviation is used to notate single-stage coolers: ТВ-N-C-h, where:
ТВ — product contraction— thermoelectric battery (cooler);
N — number of thermocouples in the cooler;
С — length of the rib of the thermoelectric element basis (in millimeters);
h — height of the thermoelectric element (in millimeters)
For example, in the module ТВ-109-0.6-0.8: 109 thermocouples (218 thermoelectric elements), every element has the cross-section of 0.6×0.6 mm and is 0.8 mm high.
| Name |
Imax
(A) |
Qmax
(W) |
Umax
(V) |
dTmax
(K) |
R
(Ohm) |
A
(mm) |
B
(mm) |
C
(mm) |
D
(mm) |
H
(mm) |
|
|
0.7 |
0.4 |
1.0 |
67 |
1.20 |
3.4 |
3.4 |
5.0 |
3.4 |
2.30 |
|
|
0.7 |
0.6 |
1.4 |
67 |
1.80 |
5.0 |
3.4 |
5.0 |
5.0 |
2.30 |
|
|
0.7 |
0.9 |
2.2 |
67 |
2.80 |
5.0 |
5.0 |
6.6 |
5.0 |
2.30 |
|
|
0.7 |
1.7 |
3.9 |
67 |
5.00 |
6.6 |
6.6 |
8.3 |
6.6 |
2.30 |
|
|
0.7 |
3.5 |
8.0 |
67 |
10.00 |
9.1 |
9.9 |
11.5 |
9.1 |
2.30 |
|
|
1.1 |
0.6 |
0.9 |
69 |
0.59 |
4.3 |
4.3 |
4.3 |
4.3 |
3.25 |
|
|
1.1 |
0.9 |
1.4 |
69 |
0.91 |
9.0 |
4.0 |
4.0 |
9.0 |
3.25 |
|
|
1.1 |
1.4 |
2.1 |
69 |
1.50 |
6.3 |
6.3 |
6.3 |
6.3 |
3.25 |
|
|
1.1 |
2.6 |
3.8 |
69 |
2.55 |
8.0 |
8.0 |
8.0 |
8.0 |
3.25 |
|
|
1.1 |
3.0 |
4.3 |
69 |
3.10 |
12.0 |
6.0 |
6.0 |
12.0 |
3.25 |
|
|
1.1 |
5.5 |
8.1 |
69 |
5.60 |
13.0 |
12.0 |
12.0 |
13.0 |
3.25 |
|
|
1.4 |
0.7 |
0.9 |
69 |
0.51 |
4.3 |
4.3 |
4.3 |
4.3 |
2.95 |
|
|
1.4 |
1.2 |
1.4 |
69 |
0.75 |
9.0 |
4.0 |
4.0 |
9.0 |
2.95 |
|
|
1.4 |
1.8 |
2.1 |
69 |
1.20 |
6.3 |
6.3 |
6.3 |
6.3 |
2.95 |
|
|
1.4 |
3.3 |
3.8 |
69 |
2.05 |
8.0 |
8.0 |
8.0 |
8.0 |
2.95 |
|
|
1.4 |
3.7 |
4.3 |
69 |
2.40 |
12.0 |
6.0 |
6.0 |
12.0 |
2.95 |
|
|
1.4 |
6.9 |
8.1 |
69 |
4.60 |
13.0 |
12.0 |
12.0 |
13.0 |
2.95 |
|
|
1.7 |
0.9 |
0.9 |
69 |
0.39 |
4.3 |
4.3 |
4.3 |
4.3 |
2.75 |
|
|
1.7 |
1.4 |
1.4 |
69 |
0.62 |
9.0 |
4.0 |
4.0 |
9.0 |
2.75 |
|
|
1.7 |
2.2 |
2.1 |
69 |
0.95 |
6.3 |
6.3 |
6.3 |
6.3 |
2.75 |
|
|
1.7 |
3.9 |
3.8 |
69 |
1.70 |
8.0 |
8.0 |
8.0 |
8.0 |
2.75 |
|
|
1.7 |
4.4 |
4.3 |
69 |
2.08 |
12.0 |
6.0 |
6.0 |
12.0 |
2.75 |
|
|
1.7 |
8.3 |
8.1 |
69 |
4.00 |
13.0 |
12.0 |
12.0 |
13.0 |
2.75 |
|
|
2.1 |
1.1 |
0.9 |
68 |
0.34 |
4.3 |
4.3 |
4.3 |
4.3 |
2.55 |
|
|
2.1 |
2.6 |
2.1 |
68 |
0.76 |
6.3 |
6.3 |
6.3 |
6.3 |
2.55 |
|
|
2.1 |
4.8 |
3.8 |
68 |
1.40 |
8.0 |
8.0 |
8.0 |
8.0 |
2.55 |
|
|
2.1 |
5.4 |
4.3 |
68 |
1.70 |
12.0 |
6.0 |
6.0 |
12.0 |
2.55 |
|
|
2.1 |
10.1 |
8.0 |
68 |
3.00 |
13.0 |
12.0 |
12.0 |
13.0 |
2.55 |
|
|
2.1 |
16.9 |
13.4 |
68 |
5.30 |
26.0 |
12.0 |
12.0 |
26.0 |
2.55 |
|
TB-17-1.0-0.7 |
6.6 |
8.4 |
2.1 |
68 |
0.24 |
8.0 |
8.0 |
8.0 |
8.0 |
2.45 |
STANDARD TERMS OF DELIVERY:
— substrate material — alumina (ВК-96)
— height tolerance ± 0,15 mm
— parallelism 0,15 mm
— cable length 50 mm
— pin orientation (for rectangular coolers) — to the longer side
— processing temperature up to 80°С, maximal assembly temperature 120°С (assembly solder Tm = 139°С)
ADDITIONAL OPTIONS
|
Description |
Notation (*) |
Note |
| processing temperature up to 120 °C, max assembly temperature = 130 °C |
HT(120) |
assembly solder with Tm = 139 °C |
| processing temperature up to 150 °C, max assembly temperature = 170 °C |
HT(150) |
assembly solder Pb-Sn with Tm = 183 °C |
| processing temperature up to 200 °C, max assembly temperature = 220 °C |
HT(200) |
assembly solder with Tm = 232 °C |
| height tolerance = ± 0.05 mm and parallelism 0.03 mm |
L1 |
|
| height tolerance = ± 0.025 mm and parallelism 0.02 mm |
L2 |
|
| metallization of cold (mc) and (or) hot side of cooler with solder tinning (melting temperature = 95 °C, 117 °C, 139 °C, 183 °C) |
mc95, mh95, mm117 etc. |
|
| gold plating |
mcAu, mhAu, mmAu |
metallization Cu-Ni-Au (0.2-1 micron) |
| substrate material – aluminium nitride (AlN) |
N |
heat conductivity > 180 W/mK |
| sealant: epoxy, silicon, urethane, conformal coating |
E, S, U, Сс |
|
| non-standard pin orientation |
|
|
| type and length of wires by customer’s requirement |
|
|
| soldering on cold or hot heatsink, packaging or cold block |
|
| |
